Description
System Features
- Low maintenance cost
- Marking a variety of material
- Cost cheap, easy to operate
- Marking depth is easy to control
- Large marking area
- StGLe performance
Applications
- Clothing, Medical Packaging, Ceramics, Beverage Packaging, Fabric cutting,Rubber, Shell Plate, Electronic
- Components, Gifts, Leather, etc
- Marking, Micro Hole Processing
- Wafer Marking
| Model |
GS-C30M |
GS-C60M |
| Wavelangth |
9.3um / 10.6um |
| Laser Power |
30W |
60W |
| Power Stability |
〉±1% RMS |
〉±1% RMS |
| Marking speed |
≤5000mm/s |
≤5000mm/s |
| Marking area |
100mmx100mm-300mmx300mm |
| Marking width |
0.1mm |
0.15mm |
| Minimum char actar |
0.4mm |
0.6mm |
| Repaatability |
±0.01 |
±0.01 |
| Cooling mode |
Air cooling |
| Power requir ement |
220V/20A/50Hz |
220V/20A/50Hz |
| Power |
1200W |
2000W |
| Size |
740mmx1150mmx1500mm |
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